SMT & THM Assembly

Precision Mounting for Complex Designs

We offer expert assembly using both Surface Mount Technology (SMT) and Through-Hole Mounting (THM) techniques, selecting the ideal process based on your component and design needs.

SMT

Compact, high-speed assembly for ICs, resistors, and small components

THM

Reliable connections for large or high-stress components via plated through-holes

Complete System Integration, Precision Assembly

Scalable solutions from concept to mass production

ISO-compliant processes and quality assurance

Dedicated technical and logistics support teams

FAQs

1. What is the difference between SMT and THM assembly?

SMT (Surface Mount Technology) involves placing components directly onto the surface of a PCB, ideal for compact, high-speed electronics. THM (Through-Hole Mount) involves inserting leads through holes in the PCB and soldering them on the opposite side, often used for mechanically strong or power-handling components.

2. When should I choose SMT over THM (or vice versa)?

Choose SMT for high-density, lightweight, and high-speed applications such as consumer electronics. Use THM when durability and stronger mechanical bonding are required, such as in aerospace, industrial, or power electronics.

3. Can you combine SMT and THM components in one assembly?

Yes, we provide mixed-technology assembly combining both SMT and THM components on the same PCB when the design demands it. This is common in many industrial and embedded systems.

4. What is your capability in terms of SMT component size?

We can place components as small as 01005 package size with high-speed, high-precision pick-and-place machines, suitable for ultra-miniaturised designs.

5. Do you offer automated inspection and testing for SMT/THM assemblies?

Absolutely. We use AOI (Automated Optical Inspection) for SMT, X-ray inspection for BGAs and hidden joints, and manual or ICT testing for THM assemblies to ensure maximum reliability and performance.

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